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Cut Off Wheel
Product Details:
- Shape Round
- Width less than 0.1mm to 2.7 thickness Millimeter (mm)
- Length 50 to 355 OD Millimeter (mm)
- Size 50 to 355 OD, less than 0.1mm to 2.7mm thickness
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Cut Off Wheel Product Specifications
- 50 to 355 OD Millimeter (mm)
- 50 to 355 OD, less than 0.1mm to 2.7mm thickness
- less than 0.1mm to 2.7 thickness Millimeter (mm)
- Round
Cut Off Wheel Trade Information
- Cash in Advance (CID)
- Western Europe Middle East Eastern Europe Asia
- All India
Product Description
Ultra-Thin Cut-Off Wheels
- These cut-off wheels support a wide range of applications for precision processing, including electronics.
- They meet micron cut (MIC) standards, for which thickness is less than 0.1 mm, and ultra cut (UT) standards, for which thickness is 0.1 mm or more.
- Wheels containing diamonds can also be produced.
GD Abrasive (Diamond Cutting Abrasive)
- GD abrasive is a diamond resinoid cut-off wheel that is composed of diamond for the abrasive and resin for the bonding material.
- This cut-off wheel is excellent at processing hard and brittle materials such as carbide, ceramics, and glass, and realizes both high-quality cutting performance and a long lifespan.
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Contact Us
Y. IKEMURA & CO., LTD.
- 1-8-6, Iidabashi, Chiyoda Ku, Tokyo - 102-0072, Japan
- Phone : 81-3-32610311
- Mr. M. Nakano (Manager)
- Mobile : +81332610311
- nakano@ikemura.jp
- 1-8-6, Iidabashi, Chiyodaku Tokyo 102-0072 Japan
Phone : 81-3-3261-0311
Fax :81-3-3261-0363
Mr. M. Nakano (Manager)
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