These cut-off wheels support a wide range of applications for precision processing, including electronics.
They meet micron cut (MIC) standards, for which thickness is less than 0.1 mm, and ultra cut (UT) standards, for which thickness is 0.1 mm or more.
Wheels containing diamonds can also be produced.
GD Abrasive (Diamond Cutting Abrasive)
GD abrasive is a diamond resinoid cut-off wheel that is composed of diamond for the abrasive and resin for the bonding material.
This cut-off wheel is excellent at processing hard and brittle materials such as carbide, ceramics, and glass, and realizes both high-quality cutting performance and a long lifespan.